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 Electronic Design & Sales, Inc.: Manufacturer Spotlight
 
 1 Crossman Rd.
Sayreville, New Jersey 08872
Ph: 732-316-2100
Fx: 732-316-1185
Email: info@solders.com
http://www.solders.com




Bow Electronic Solders has developed BLF 227, a economically priced Lead free bar solder. BLF 227 is a near eutectic alloy. This alloy is proven to perform well in surface mount, wave soldering, and hand soldering applications. BLF 227 alloy may be used with existing equipment, processes, coatings, and flux chemistries. BLF 227 alloy is available in bar, cored wire, solid wire, foil, and preforms. Bow BLF 227 compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics. BLF 227 is manufactured to material specifications to J-STD-006 or better.

 

Features:

Low cost, lead-free alloy

Smooth solder joints with no visible shrinkage effects

Excellent through-hole penetration and topside fillet

Low dissolution of copper from boards and components into solder pot

Near Eutectic alloy melting point of 227C

ROHS Complaint

Unique Shape

 

FLUX Compatibility:

BLF 227 alloy is compatible with many major electronic grade fluxes on the market today, and is available in wire form in no-clean and rosin chemistries.

 

Temperature Requirements:

 

APPLICATION RECOMMENDED TEMPERATURE

REFLOW SOLDERING PEAK TEMPERATURE 210-235C (410-455 F)

WAVE SOLDERING POT TEMPERATURE OF 265-280C (520-536F)

HAND SOLDERING TIP TEMPERATURE OF 370-425C (700-800)

 

Physical Properties:

Specific Gravity 7.31 g/cm

Tensile Strength 21.99 MPa

Storage and Shelf Life:

When stored properly these alloys have no limited shelf-life. Surface oxidation is cosmetic and will not impede product performance.

Safety:

Use with adequate ventilation and proper personal protective equipment.

Refer to the Material Safety Data Sheet for any specific emergency information.

Do not dispose of any hazardous materials in non-approved containers