| 1 Crossman Rd.|
Sayreville, New Jersey 08872
Bow Electronic Solders has developed BLF 227, a economically priced Lead free bar solder. BLF 227 is a near eutectic alloy. This alloy is proven to perform well in surface mount, wave soldering, and hand soldering applications. BLF 227 alloy may be used with existing equipment, processes, coatings, and flux chemistries. BLF 227 alloy is available in bar, cored wire, solid wire, foil, and preforms. Bow BLF 227 compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics. BLF 227 is manufactured to material specifications to J-STD-006 or better.
Low cost, lead-free alloy
Smooth solder joints with no visible shrinkage effects
Excellent through-hole penetration and topside fillet
Low dissolution of copper from boards and components into solder pot
Near Eutectic alloy melting point of 227°C
BLF 227 alloy is compatible with many major electronic grade fluxes on the market today, and is available in wire form in no-clean and rosin chemistries.
APPLICATION RECOMMENDED TEMPERATURE
REFLOW SOLDERING PEAK TEMPERATURE 210°-235°C (410°-455° F)
WAVE SOLDERING POT TEMPERATURE OF 265°-280°C (520°-536°F)
HAND SOLDERING TIP TEMPERATURE OF 370°-425°C (700°-800°)
Specific Gravity 7.31 g/cm³
Tensile Strength 21.99 MPa
Storage and Shelf Life:
When stored properly these alloys have no limited shelf-life. Surface oxidation is cosmetic and will not impede product performance.
Use with adequate ventilation and proper personal protective equipment.
Refer to the Material Safety Data Sheet for any specific emergency information.
Do not dispose of any hazardous materials in non-approved containers